Thin film RTD elements

Thin film elements are mass produced by automated equiptment which deposites a layer of platinum onto a ceramic substrate and uses a layer photolithography to etch an electrical current path corresponding to the required value of ohms. The elements are smaller than traditional wire and as a result have a faster response time and fit more applications, while reducing user costs at the same time.

Product description

Specifications:

· Tolerance: +/- 0.12% (EN60751 Class B)

· Material: Aluminum oxide substrate with fused glass cover

· Dimensional Tolerance: 400,600 °C elements +/-0.02 (0.05mm) SMT models: Length x Width +/-0.008 (0.02mm) Thickness: +/-0.004 (0.01mm)

· TCR: 0.00385 Ω/Ω/ °C

· Repeatability: +/-0.1 ° or better

· Stability: Drift less than 0.1 °C/year in normal use

· Vibration: Withstands 20 G’s minimum at 10 to 2000 Hz

· Shock: Withstands 100 G’s minimum sine wave shock of 8 miliseconds duration

Thin film RTD elements

Product description

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Product Specifications

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