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Gold bonding wire is a kind of material for inner lead with excellent electrical conductivity, mechanical properties, curvature, breaking force and excellent chemical stability. It functions primarily as a connecting material for chip and external circuit, widely used in LED packaging and IC packaging and other microelectronics industries.
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| Diameter | Weight | Elongation | Breaking load | ||
| μm Mil | mg/m | % | JC1JC2 | JC3JC4 | JE1JE2 |
| 14±1 0.5 | 2.56-3.48 | 1.0-4.0 | >2.5 | - | - |
| 15±1 0.55 | 2.97-3.98 | 2.0-5.0 | >2.5 | - | - |
| 16±1 0.6 | 3.48-4.35 | 2.0-5.0 | >2.5 | - | - |
| 17±1 0.65 | 3.98-4.9 | 2.0-5.0 | >2.5 | - | - |
| 18±1 0.7 | 4.35-5.45 | 2.0-5.0 | >2.5 | >4.0 | >5.0 |
| 19±1 0.75 | 4.90-6.10 | 2.0-6.0 | >3.0 | >4.5 | >5.5 |
| 20±1 0.8 | 5.50-6.70 | 2.0-6.0 | >4.0 | >5.0 | >6.0 |
| 21±1 0.84 | 6.07-7.35 | 2.0-6.0 | >5.0 | >6.0 | >7.0 |
| 21.5±1 0.86 | 6.38-7.69 | 2.0-6.0 | >5.0 | >6.0 | >7.0 |
| 22±1 0.88 | 6.69-8.75 | 2.5-6.5 | >5.5 | >6.5 | >7.5 |
| 23±1 0.9 | 7.35-8.75 | 2.0-7.0 | >5.0 | >7.0 | >8.0 |
| 24±1 0.95 | 8.75-9.50 | 2.0-7.0 | >6.0 | >7.5 | >8.5 |
| 25±1 1 | 8.75-10.25 | 2.0-8.0 | >7.0 | >9.0 | >10.0 |
| 27±1 1 | 10.27-11.91 | 2.5-7.5 | >8.5 | >10.5 | >11.5 |
| 28±1 1.1 | 11.05-12.75 | 2.0-8.0 | >9.0 | >12.0 | >13.0 |
| 29±1 1.2 | 11.91-13.67 | 3.0-7.5 | >10.5 | >12.5 | >14.0 |
| 30±1 1.2 | 12.75-14.75 | 3.0-8.0 | >11.0 | >13.0 | >15.0 |
| 32±1 1.25 | 14.60-16.50 | 3.0-8.0 | >12.0 | >15.0 | >16.0 |
| 33±1 1.3 | 16.50-17.50 | 3.0-10.0 | >13.0 | >16.0 | >18.0 |
| 35±1 1.4 | 17.50-19.65 | 3.0-10.0 | >15.0 | >18.0 | >20.0 |
| 38±1 1.5 | 20.75-23.10 | 3.0-10.0 | >18.0 | >21.0 | >22.0 |
| 40±1 1.6 | 23.10-26.75 | 3.0-10.0 | >20.0 | >24.0 | >26.0 |
| 42±1 1.68 | 25.53-28.09 | 3.0-11.0 | >22.0 | >26.0 | >28.0 |
| 45±1 1.8 | 29.40-32.10 | 3.0-12.0 | >25.0 | >28.0 | >30.0 |
| 50±1 2 | 34.90-41.00 | 3.0-12.0 | >30.0 | >34.0 | >36.0 |
| 60±1 2.4 | 49.30-60.25 | 7.0-14.0 | >45.0 | >50.0 | >52.0 |
| 70±1 2.8 | 68.10-80.85 | 7.0-14.0 | >55.0 | >60.0 | >63.0 |